Submolecular Ligand Size and Spacing for Cell Adhesion Year of publication 2022 Author Yuri Kim, Steve Park, Thomas Myeongseok Koo*, Ramar Thangam*, et al Journal Advanced Materials page 2110340 Link https://onlinelibrary.wiley.com/doi/full/10.1002/adma.202110340 926회 연결 . list prevGeometrically engineered rigid island array for stretchable electronics capable of withstanding various deformation modes 22.06.02 nextRapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics 22.05.18