(Under revision) All-Polyimide-Mediated Liquid Metal Assembly on Aerogels for Breathable and Robust Electronic Skins
Haijun Zhu, Jiancheng Dong*, Hao Qiu, Je Hyeong Kim, Xingyu Liu, Shiyin Liu, Mengting Zheng, Chang Zhou, Yuduo Zhang, Jiayu Hou, Kangjia Geng, Yuchen Wang, Yidong Peng, Haoran Liu, Guanzheng Wu, Yunpeng Huang, Yongsheng Luo, Steve Park*, and Tianxi Liu*
, 2026

(Under revision) Leaf-Inspired Eutectic Skin with Extreme Fatigue Resistance and Robust Wet Adhesion for Amphibious Epidermal Electronics
Jiayu Hou, Jiancheng Dong*, Je Hyeong Kim, Chang Zhou, Shiyin Lin, Xingyu Liu, Hao Qiu, Mengting Zheng, Yuduo Zhang, Haijun Zhu, Kangjia Geng, Yidong Peng, Haoran Liu, Yunpeng Huang, Yongsheng Luo, Steve Park*, and Tianxi Liu*
, 2026

(Under revision) Stretchable Morph-interactive Locking Electronics Driven by Phase-transition utilizing a Strain-insensitive Liquid Metal Particle Joule Heater
Minyong Park†, Do Hoon Lee†, Minhyung Lee, Je Hyeong Kim, Minu Kim, Seungkyu Lee, Do-Wan Kim, Steve Park* and Yang-Kyu Choi*
, 2026

(Under revision) Engineering of Strain-Stiffening Granular Hydrogels for 3D-Printed Tissue-Mimicry
Hyeokju Chae†, Joohwan Han†, Jeong-Wook Seo, Taehoon Lee, Kihyeon Bae, Ikjin Kim*, Jin-Oh Kim*, Steve Park*
, 2026

(Accepted) Figueira Cheese-Inspired Hierarchical Nanocomposites: Combining Ultralow Percolation and Breathability toward Full-Lifecycle Circular Epidermal Electronics
Kangjia Geng, Yuduo Zhang, Mengting Zheng, Chuai Tian, Yuyang Zhou, Hao Qiu, ChangZhou, Jiayu Hou, Haijun Zhu, Yuchen Wang, Yidong Peng, Haoran Liu, Guanzheng Wud, Steve Park, Yongsheng Luo*, Yunpeng Huanga*, Jiancheng Dong* and Tianxi Liu
Advanced Functional Materials, 2026

(Accepted) Durable skin-integrated liquid metal-based conductive tattoo for imperceptible and untethered human machine interfaces
Gyeongsuk Park†, Dongeun Kim†, Hanbit Jin†, Je Hyeong Kim†, Jung Rak Choi, Minu Kim, Seungkyu Lee, Minhyung Lee, Youngju Son, Sangyong Jon, Hye Jin Kim*, and Steve Park*
npj Flexible Electronics, 2026

Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics
Do Hoon Lee†, Seungkyu Lee†, Minyong Park, Junehyeok Kim, Hanbit Jin, Su Yeong Kim, Donghyun Lee, Young-Soo Lim, Jun Chang Yang, Taehoon Lee, Byungkook Oh, Sang Yu Sun, Do-Wan Kim, Sihong Wang, Sung Gap Im, Hye Jin Kim, Sung-Min Park, Jihan Kim, Yang-Kyu Choi*, and Steve Park*
Nature Communications, 2026

LLMB: AI Agent for Lithium Metal Battery Research Using Large Language Model
Jaewoong Lee†, Junhee Woo†, Younghun Kim, Sejin Kim, Cinthya Paulina, Hyunmin Park, Hee-Tak Kim*, Steve Park*, and Jihan Kim*
ACS Central Science, 2026

(Accepted) Addressing Low E/S and N/P Ratio Challenges in Li–S Batteries with a Multifunctional Interlayer
Cinthya Paulina†, Donghyeok Son†, Huiwon Jang†, Hyunmin Park, Junhee Woo, Su Yeong Kim, Dongsoo Kim, Jihan Kim*, Jinwoo Lee*, and Steve Park*
Small, 2026

3D-Printed Hierarchically Porous Hydrogel Scaffolds with Enhanced Shape Fidelity and Structural Durability via Network-Assisted Freeze-Thaw (NAFT) Processing
Minjoo Kang†, Taehoon Lee†, Bolam Kim, Minki Kim, Ikjin Kim, Yeontaek Lee, Kyusoon Pak, Dong Soo Kim, Jin-Oh Kim*, Steve Park*
Advanced Functional Materials, 2025

Gastric Cancer Organoids and Their Convergence in Engineering Approaches
SoEun Lim†, So Hee Kim, Hye-Jin Jeong, Steve Park, Bon-Kyoung Koo*, Ji-Hyun Lee*, and Woojung Shin*
FEBS Letters, 2025

Optisense: Computational Optimization for Strain Sensor Placement in Wearable Motion Tracking Systems
Minu Kim†, Juhyung Ahn, Jieun Seo, Steve Park*, and Joo Yong Sim*
Advanced Intelligent Systems, 2025

An Ionic Gelation Powder for Ultrafast Hemostasis and Accelerated Wound Healing
Youngju Son†, Kyusoon Pak†, Taehoon Lee, Monica Celine Prayogo, Jinyoung Choi, Sukkyung Kang, Minjoo Kang, Byungkook Oh, Sang Yu Sun, Sanha Kim, Sung Gap Im, Sangyong Jon*, Steve Park*
Advanced Functional Materials, e23910, 2025

Designing pores to suppress crack generation at the interface between serpentine interconnects and elastomers for highly durable stretchable electronics
Seungkyu Lee†, Jun Chang Yang*, and Steve Park*
Materials Horizons, 12, 7033, 2025

Fabrication of Multifunctional Wearable Interconnect E-textile Platform Using Direct Ink Writing (DIW) 3D Printing
Kyusoon Pak†, Jun Chang Yang, Joo Yong Sim, Taehoon Lee, Do Hoon Lee, Seungkyu Lee, Minjoo Kang, Byungkook Oh, Jin-Oh Kim*, and Steve Park*
npj Flexible Electronics, 9, 48, 2025