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Body-Temperature Softening Electronic Ink for Additive Manufacturing of Transformative Bioelectronics via Direct Writing

Year of publication: 2024

Author: Do A Kwon†, S. Lee, C. Y. Kim, I. Kang, Steve Park*, Jae-Woong Jeong*

Journal: Science Advances

Link: https://www.science.org/doi/pdf/10.1126/sciadv.adn1186 2542회 연결

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